Hayashi Pure Chemical Ind., Ltd.

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Product Description

Film Etchant

Cu Seed Layer Etchant Pure Etch C203, C210

For etching of Cu seed layers of Cu plating and Cu seed structures with little damage to Cu-plated wires and bumps.

Keywords: wet etching, copper, plating, seed layer, selective semi-additive process

Features

  • Less impact on Cu plating
  • Less surface roughness on Cu
  • Can be used to etch any Cu seed layer. (Electroless Cu plating, Sputtering)
  • Accommodates a variety of processes, including dipping, spraying, and spinning.