Hayashi Pure Chemical Ind., Ltd.


Product Description

Film Etchant

Cu Seed Layer Etchant Pure Etch C203, C210

For etching of Cu seed layers of Cu plating and Cu seed structures with little damage to Cu-plated wires and bumps.

Keywords: wet etching, copper, plating, seed layer, selective semi-additive process


  • Less impact on Cu plating
  • Less surface roughness on Cu
  • Can be used to etch any Cu seed layer. (Electroless Cu plating, Sputtering)
  • Accommodates a variety of processes, including dipping, spraying, and spinning.