Cu Seed Layer Etchant Pure Etch C203, C210
For etching of Cu seed layers of Cu plating and Cu seed structures with little damage to Cu-plated wires and bumps.
Keywords: wet etching, copper, plating, seed layer, selective semi-additive process
- Less impact on Cu plating
- Less surface roughness on Cu
- Can be used to etch any Cu seed layer. (Electroless Cu plating, Sputtering)
- Accommodates a variety of processes, including dipping, spraying, and spinning.